M74HC623B1R
vs
HD74HC623P
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
STMICROELECTRONICS
|
RENESAS ELECTRONICS CORP
|
| Part Package Code |
DIP
|
DIP
|
| Package Description |
DIP, DIP20,.3
|
DIP, DIP20,.3
|
| Pin Count |
20
|
20
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Additional Feature |
WITH INDEPENDENT OUTPUT ENABLE FOR EACH DIRECTION
|
|
| Control Type |
INDEPENDENT CONTROL
|
INDEPENDENT CONTROL
|
| Count Direction |
BIDIRECTIONAL
|
BIDIRECTIONAL
|
| Family |
HC/UH
|
|
| JESD-30 Code |
R-PDIP-T20
|
R-PDIP-T20
|
| JESD-609 Code |
e3
|
|
| Load Capacitance (CL) |
150 pF
|
|
| Logic IC Type |
BUS TRANSCEIVER
|
|
| Max I(ol) |
0.006 A
|
0.006 A
|
| Number of Bits |
8
|
8
|
| Number of Functions |
1
|
1
|
| Number of Ports |
2
|
|
| Number of Terminals |
20
|
20
|
| Operating Temperature-Max |
125 °C
|
85 °C
|
| Operating Temperature-Min |
-55 °C
|
-40 °C
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Output Polarity |
TRUE
|
TRUE
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
DIP
|
| Package Equivalence Code |
DIP20,.3
|
DIP20,.3
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Packing Method |
TUBE
|
|
| Prop. Delay@Nom-Sup |
26 ns
|
25 ns
|
| Propagation Delay (tpd) |
195 ns
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
3.93 mm
|
|
| Supply Voltage-Max (Vsup) |
6 V
|
|
| Supply Voltage-Min (Vsup) |
2 V
|
|
| Supply Voltage-Nom (Vsup) |
4.5 V
|
|
| Surface Mount |
NO
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
INDUSTRIAL
|
| Terminal Finish |
MATTE TIN
|
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
7.62 mm
|
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
No
|
|
|
|
Compare M74HC623B1R with alternatives
Compare HD74HC623P with alternatives