M74HC75B1R
vs
100355MW8
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
STMICROELECTRONICS
|
NATIONAL SEMICONDUCTOR CORP
|
| Part Package Code |
DIP
|
|
| Package Description |
DIP, DIP16,.3
|
DIE,
|
| Pin Count |
16
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Family |
HC/UH
|
100K
|
| JESD-30 Code |
R-PDIP-T16
|
X-XUUC-N
|
| JESD-609 Code |
e3
|
|
| Load Capacitance (CL) |
50 pF
|
|
| Logic IC Type |
D LATCH
|
D LATCH
|
| Max I(ol) |
0.004 A
|
|
| Number of Bits |
2
|
4
|
| Number of Functions |
2
|
1
|
| Number of Terminals |
16
|
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Output Polarity |
COMPLEMENTARY
|
COMPLEMENTARY
|
| Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
| Package Code |
DIP
|
DIE
|
| Package Equivalence Code |
DIP16,.3
|
DIE OR CHIP
|
| Package Shape |
RECTANGULAR
|
UNSPECIFIED
|
| Package Style |
IN-LINE
|
UNCASED CHIP
|
| Packing Method |
TUBE
|
|
| Prop. Delay@Nom-Sup |
33 ns
|
|
| Propagation Delay (tpd) |
190 ns
|
2.2 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
5.1 mm
|
|
| Supply Voltage-Max (Vsup) |
6 V
|
|
| Supply Voltage-Min (Vsup) |
2 V
|
|
| Supply Voltage-Nom (Vsup) |
4.5 V
|
|
| Surface Mount |
NO
|
YES
|
| Technology |
CMOS
|
ECL
|
| Temperature Grade |
MILITARY
|
MILITARY
|
| Terminal Finish |
MATTE TIN
|
|
| Terminal Form |
THROUGH-HOLE
|
NO LEAD
|
| Terminal Pitch |
2.54 mm
|
|
| Terminal Position |
DUAL
|
UPPER
|
| Trigger Type |
HIGH LEVEL
|
LOW LEVEL
|
| Width |
7.62 mm
|
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare M74HC75B1R with alternatives
Compare 100355MW8 with alternatives