M74HC75M1R
vs
M38510/31603BFA
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
STMICROELECTRONICS
|
LANSDALE SEMICONDUCTOR INC
|
| Part Package Code |
SOIC
|
DFP
|
| Package Description |
SOP, SOP16,.25
|
DFP, FL16,.3
|
| Pin Count |
16
|
16
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Family |
HC/UH
|
LS
|
| JESD-30 Code |
R-PDSO-G16
|
R-GDFP-F16
|
| JESD-609 Code |
e4
|
e0
|
| Length |
9.9 mm
|
|
| Load Capacitance (CL) |
50 pF
|
|
| Logic IC Type |
D LATCH
|
D LATCH
|
| Max I(ol) |
0.004 A
|
0.004 A
|
| Moisture Sensitivity Level |
3
|
|
| Number of Bits |
2
|
8
|
| Number of Functions |
2
|
1
|
| Number of Terminals |
16
|
16
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Output Polarity |
COMPLEMENTARY
|
TRUE
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, GLASS-SEALED
|
| Package Code |
SOP
|
DFP
|
| Package Equivalence Code |
SOP16,.25
|
FL16,.3
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
FLATPACK
|
| Packing Method |
TUBE
|
|
| Prop. Delay@Nom-Sup |
33 ns
|
56 ns
|
| Propagation Delay (tpd) |
190 ns
|
56 ns
|
| Qualification Status |
Not Qualified
|
Qualified
|
| Seated Height-Max |
1.75 mm
|
|
| Supply Voltage-Max (Vsup) |
6 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
2 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
4.5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
TTL
|
| Temperature Grade |
MILITARY
|
MILITARY
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
TIN LEAD
|
| Terminal Form |
GULL WING
|
FLAT
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Trigger Type |
HIGH LEVEL
|
NEGATIVE EDGE
|
| Width |
3.9 mm
|
|
| Base Number Matches |
1
|
1
|
| Power Supply Current-Max (ICC) |
|
36 mA
|
| Screening Level |
|
MIL-PRF-38535 Class B
|
|
|
|
Compare M74HC75M1R with alternatives
Compare M38510/31603BFA with alternatives