M74HCT138RM13TR vs N74LS138N feature comparison

M74HCT138RM13TR STMicroelectronics

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N74LS138N NXP Semiconductors

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Pbfree Code Yes
Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer STMICROELECTRONICS NXP SEMICONDUCTORS
Part Package Code SOIC
Package Description SOP-16 DIP, DIP16,.3
Pin Count 16
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature 3 ENABLE INPUTS
Family HCT LS
Input Conditioning STANDARD STANDARD
JESD-30 Code R-PDSO-G16 R-PDIP-T16
JESD-609 Code e4 e0
Length 9.9 mm
Load Capacitance (CL) 50 pF
Logic IC Type 3-LINE TO 8-LINE DECODER 3-LINE TO 8-LINE DECODER
Max I(ol) 0.004 A 0.008 A
Moisture Sensitivity Level 3
Number of Functions 1 1
Number of Terminals 16 16
Operating Temperature-Max 125 °C 70 °C
Operating Temperature-Min -55 °C
Output Polarity INVERTED INVERTED
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP DIP
Package Equivalence Code SOP16,.25 DIP16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE IN-LINE
Packing Method TR
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 45 ns 41 ns
Propagation Delay (tpd) 45 ns 41 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.75 mm
Supply Voltage-Max (Vsup) 5.5 V 5.25 V
Supply Voltage-Min (Vsup) 4.5 V 4.75 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES NO
Technology CMOS TTL
Temperature Grade MILITARY COMMERCIAL
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au) TIN LEAD
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 3.9 mm
Base Number Matches 1 1
Power Supply Current-Max (ICC) 10 mA

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