MACH231SP-14YI vs EPM7064LI68-15 feature comparison

MACH231SP-14YI Lattice Semiconductor Corporation

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EPM7064LI68-15 Intel Corporation

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer LATTICE SEMICONDUCTOR CORP INTEL CORP
Package Description PLASTIC, QFP-100 PLASTIC, LCC-68
Reach Compliance Code not_compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature YES CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V
Clock Frequency-Max 54 MHz 100 MHz
In-System Programmable YES NO
JESD-30 Code R-PQFP-G100 S-PQCC-J68
JESD-609 Code e0 e0
JTAG BST NO NO
Length 20 mm 24.2316 mm
Moisture Sensitivity Level 3 3
Number of Dedicated Inputs 2
Number of I/O Lines 64 52
Number of Macro Cells 128 64
Number of Terminals 100 68
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 2 DEDICATED INPUTS, 64 I/O 0 DEDICATED INPUTS, 52 I/O
Output Function MACROCELL MACROCELL
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QFP QCCJ
Package Equivalence Code QFP100,.7X.9 LDCC68,1.0SQ
Package Shape RECTANGULAR SQUARE
Package Style FLATPACK CHIP CARRIER
Peak Reflow Temperature (Cel) 225
Programmable Logic Type EE PLD EE PLD
Propagation Delay 14 ns 15 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.4 mm 5.08 mm
Supply Voltage-Max 5.5 V 5.5 V
Supply Voltage-Min 4.5 V 4.5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form GULL WING J BEND
Terminal Pitch 0.65 mm 1.27 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) 30
Width 14 mm 24.2316 mm
Base Number Matches 1 1

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