MAX13013EXT+
vs
SN74AUP1T97YZPR
feature comparison
Pbfree Code |
Yes
|
Yes
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Transferred
|
Active
|
Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
TEXAS INSTRUMENTS INC
|
Part Package Code |
SOIC
|
BGA
|
Package Description |
TSSOP, TSSOP6,.08
|
DSBGA-6
|
Pin Count |
6
|
6
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Interface IC Type |
INTERFACE CIRCUIT
|
INTERFACE CIRCUIT
|
JESD-30 Code |
R-PDSO-G6
|
R-XBGA-B6
|
JESD-609 Code |
e4
|
e1
|
Length |
2 mm
|
1.4 mm
|
Moisture Sensitivity Level |
1
|
1
|
Number of Functions |
1
|
1
|
Number of Terminals |
6
|
6
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
Package Code |
TSSOP
|
VFBGA
|
Package Equivalence Code |
TSSOP6,.08
|
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.1 mm
|
0.5 mm
|
Supply Voltage-Max |
3.6 V
|
3.6 V
|
Supply Voltage-Min |
1.65 V
|
2.3 V
|
Supply Voltage-Nom |
2.5 V
|
2.5 V
|
Supply Voltage1-Max |
3.2 V
|
|
Supply Voltage1-Min |
1.2 V
|
|
Supply Voltage1-Nom |
1.8 V
|
|
Surface Mount |
YES
|
YES
|
Technology |
BICMOS
|
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
NICKEL PALLADIUM GOLD
|
TIN SILVER COPPER
|
Terminal Form |
GULL WING
|
BALL
|
Terminal Pitch |
0.65 mm
|
0.5 mm
|
Terminal Position |
DUAL
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Width |
1.25 mm
|
0.9 mm
|
Base Number Matches |
2
|
1
|
Samacsys Manufacturer |
|
Texas Instruments
|
Number of Bits |
|
1
|
Number of Channels |
|
1
|
Output Characteristics |
|
PUSH-PULL
|
Supply Current-Max |
|
0.0009 mA
|
|
|
|
Compare MAX13013EXT+ with alternatives
Compare SN74AUP1T97YZPR with alternatives