MAX1791EUB+T
vs
MIC2182-3.3YSM
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
MICREL INC
|
| Part Package Code |
SOIC
|
|
| Package Description |
MICRO MAX PACKAGE-10
|
LEAD FREE, SSOP-16
|
| Pin Count |
10
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.31.00.01
|
|
| Analog IC - Other Type |
SWITCHING CONTROLLER
|
SWITCHING CONTROLLER
|
| Control Mode |
CURRENT-MODE
|
CURRENT-MODE
|
| Control Technique |
PULSE WIDTH MODULATION
|
PULSE WIDTH MODULATION
|
| Input Voltage-Max |
20 V
|
32 V
|
| Input Voltage-Min |
5 V
|
4.5 V
|
| Input Voltage-Nom |
15 V
|
15 V
|
| JESD-30 Code |
S-PDSO-G10
|
R-PDSO-G16
|
| JESD-609 Code |
e4
|
e3
|
| Length |
3 mm
|
6.2 mm
|
| Moisture Sensitivity Level |
1
|
2
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
10
|
16
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TSSOP
|
SSOP
|
| Package Equivalence Code |
TSSOP10,.19,20
|
SSOP16,.3
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.1 mm
|
2 mm
|
| Surface Mount |
YES
|
YES
|
| Switcher Configuration |
PUSH-PULL
|
PUSH-PULL
|
| Switching Frequency-Max |
328 kHz
|
330 kHz
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
Matte Tin (Sn)
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.65 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
40
|
| Width |
3 mm
|
5.3 mm
|
| Base Number Matches |
2
|
2
|
| Output Voltage-Nom |
|
3.3 V
|
| Technology |
|
BICMOS
|
|
|
|
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