MAX1821EUB
vs
LM2706TL
feature comparison
Pbfree Code |
No
|
Yes
|
Rohs Code |
No
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
NATIONAL SEMICONDUCTOR CORP
|
Part Package Code |
TSSOP
|
BGA
|
Package Description |
TSSOP, TSSOP10,.19,20
|
VFBGA, BGA10,3X4,20
|
Pin Count |
10
|
10
|
Reach Compliance Code |
not_compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Analog IC - Other Type |
SWITCHING REGULATOR
|
SWITCHING REGULATOR
|
Control Mode |
CURRENT-MODE
|
VOLTAGE-MODE
|
Control Technique |
PULSE WIDTH MODULATION
|
PULSE WIDTH MODULATION
|
Input Voltage-Max |
5.5 V
|
5.5 V
|
Input Voltage-Min |
2.6 V
|
2.7 V
|
Input Voltage-Nom |
3.6 V
|
3.6 V
|
JESD-30 Code |
S-PDSO-G10
|
R-PBGA-B10
|
JESD-609 Code |
e0
|
e1
|
Length |
3 mm
|
2.504 mm
|
Moisture Sensitivity Level |
1
|
1
|
Number of Functions |
1
|
1
|
Number of Terminals |
10
|
10
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-25 °C
|
Output Current-Max |
1.55 A
|
0.75 A
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
TSSOP
|
VFBGA
|
Package Equivalence Code |
TSSOP10,.19,20
|
BGA10,3X4,20
|
Package Shape |
SQUARE
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
Peak Reflow Temperature (Cel) |
245
|
260
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.1 mm
|
0.675 mm
|
Surface Mount |
YES
|
YES
|
Switcher Configuration |
BUCK
|
BUCK
|
Switching Frequency-Max |
1200 kHz
|
700 kHz
|
Temperature Grade |
INDUSTRIAL
|
OTHER
|
Terminal Finish |
TIN LEAD
|
TIN SILVER COPPER
|
Terminal Form |
GULL WING
|
BALL
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
DUAL
|
BOTTOM
|
Width |
3 mm
|
1.996 mm
|
Base Number Matches |
4
|
2
|
Time@Peak Reflow Temperature-Max (s) |
|
40
|
|
|
|
Compare MAX1821EUB with alternatives
Compare LM2706TL with alternatives