MAX1821EUB
vs
LM2706TLX
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
ROCHESTER ELECTRONICS LLC
|
NATIONAL SEMICONDUCTOR CORP
|
| Part Package Code |
TSSOP
|
|
| Package Description |
MO-187C-BA, MSOP-10
|
VFBGA, BGA10,3X4,20
|
| Pin Count |
10
|
|
| Reach Compliance Code |
unknown
|
compliant
|
| Analog IC - Other Type |
SWITCHING REGULATOR
|
SWITCHING REGULATOR
|
| Control Mode |
CURRENT-MODE
|
VOLTAGE-MODE
|
| Control Technique |
PULSE WIDTH MODULATION
|
PULSE WIDTH MODULATION
|
| Input Voltage-Max |
5.5 V
|
5.5 V
|
| Input Voltage-Min |
2.6 V
|
2.7 V
|
| Input Voltage-Nom |
3.6 V
|
3.6 V
|
| JESD-30 Code |
S-PDSO-G10
|
R-PBGA-B10
|
| JESD-609 Code |
e0
|
e1
|
| Length |
3 mm
|
2.504 mm
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
10
|
10
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-25 °C
|
| Output Current-Max |
1.55 A
|
0.75 A
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TSSOP
|
VFBGA
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
240
|
260
|
| Seated Height-Max |
1.1 mm
|
0.675 mm
|
| Surface Mount |
YES
|
YES
|
| Switcher Configuration |
BUCK
|
BUCK
|
| Switching Frequency-Max |
1200 kHz
|
700 kHz
|
| Temperature Grade |
INDUSTRIAL
|
OTHER
|
| Terminal Finish |
TIN LEAD
|
TIN SILVER COPPER
|
| Terminal Form |
GULL WING
|
BALL
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
DUAL
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
20
|
40
|
| Width |
3 mm
|
1.996 mm
|
| Base Number Matches |
2
|
2
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8542.39.00.01
|
| Package Equivalence Code |
|
BGA10,3X4,20
|
| Qualification Status |
|
Not Qualified
|
|
|
|
Compare MAX1821EUB with alternatives
Compare LM2706TLX with alternatives