MAX1901ETJ
vs
MAX1901ETJ-T
feature comparison
Pbfree Code |
No
|
Yes
|
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Obsolete
|
Active
|
Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
ROCHESTER ELECTRONICS LLC
|
Part Package Code |
QFN
|
QFN
|
Package Description |
5 X 5 MM, 0.80 MM, MO-220WHHD-2, TQFN-32
|
5 X 5 MM, 0.80 MM, MO-220WHHD-2, TQFN-32
|
Pin Count |
32
|
32
|
Reach Compliance Code |
not_compliant
|
unknown
|
ECCN Code |
EAR99
|
|
HTS Code |
8542.39.00.01
|
|
Analog IC - Other Type |
DUAL SWITCHING CONTROLLER
|
DUAL SWITCHING CONTROLLER
|
Control Mode |
CURRENT-MODE
|
CURRENT-MODE
|
Control Technique |
PULSE WIDTH MODULATION
|
PULSE WIDTH MODULATION
|
Input Voltage-Max |
30 V
|
30 V
|
Input Voltage-Min |
4.2 V
|
4.2 V
|
Input Voltage-Nom |
15 V
|
15 V
|
JESD-30 Code |
S-XQCC-N32
|
S-XQCC-N32
|
JESD-609 Code |
e0
|
e0
|
Length |
5 mm
|
5 mm
|
Moisture Sensitivity Level |
1
|
1
|
Number of Functions |
1
|
1
|
Number of Terminals |
32
|
32
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output Current-Max |
0.2 A
|
0.2 A
|
Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
Package Code |
HVQCCN
|
HVQCCN
|
Package Equivalence Code |
LCC28,.2SQ,20
|
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
Peak Reflow Temperature (Cel) |
245
|
245
|
Qualification Status |
Not Qualified
|
|
Seated Height-Max |
0.8 mm
|
0.8 mm
|
Surface Mount |
YES
|
YES
|
Switcher Configuration |
PUSH-PULL
|
PUSH-PULL
|
Switching Frequency-Max |
550 kHz
|
550 kHz
|
Technology |
BICMOS
|
BICMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
TIN LEAD
|
TIN LEAD
|
Terminal Form |
NO LEAD
|
NO LEAD
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
QUAD
|
QUAD
|
Width |
5 mm
|
5 mm
|
Base Number Matches |
4
|
1
|
Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
Compare MAX1901ETJ with alternatives
Compare MAX1901ETJ-T with alternatives