MAX24305EXG2
vs
MAX24305EXG+
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
Package Description |
CSBGA-81
|
10 X 10 MM, ROHS COMPLIANT, CSBGA-81
|
Reach Compliance Code |
compliant
|
compliant
|
Additional Feature |
3.3 V NOMINAL ALSO AVAILABLE
|
|
Applications |
SONET;SDH
|
|
JESD-30 Code |
S-PBGA-B81
|
S-PBGA-B81
|
JESD-609 Code |
e1
|
|
Length |
10 mm
|
10 mm
|
Number of Functions |
1
|
1
|
Number of Terminals |
81
|
81
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LBGA
|
LBGA
|
Package Equivalence Code |
BGA81,9X9,40
|
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY, LOW PROFILE
|
GRID ARRAY, LOW PROFILE
|
Seated Height-Max |
1.47 mm
|
1.47 mm
|
Supply Current-Max |
441 mA
|
|
Supply Voltage-Nom |
1.8 V
|
1.8 V
|
Surface Mount |
YES
|
YES
|
Telecom IC Type |
ATM/SONET/SDH SUPPORT CIRCUIT
|
ATM/SONET/SDH SUPPORT CIRCUIT
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
TIN SILVER COPPER
|
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Width |
10 mm
|
10 mm
|
Base Number Matches |
1
|
2
|
Peak Reflow Temperature (Cel) |
|
260
|
Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|