MAX24310EXG+
vs
SI5345D-D13566-GM
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
MICROSEMI CORP
|
SKYWORKS SOLUTIONS INC
|
| Part Package Code |
BGA
|
|
| Package Description |
10 X 10 MM, ROHS COMPLIANT, CSBGA-81
|
QFN-64
|
| Pin Count |
81
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
|
| JESD-30 Code |
S-PBGA-B81
|
S-PQCC-N44
|
| Length |
10 mm
|
9 mm
|
| Number of Functions |
1
|
|
| Number of Terminals |
81
|
64
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LBGA
|
HVQCCN
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY, LOW PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Seated Height-Max |
1.47 mm
|
0.9 mm
|
| Supply Voltage-Nom |
1.8 V
|
1.8 V
|
| Surface Mount |
YES
|
YES
|
| Telecom IC Type |
ATM/SONET/SDH SUPPORT CIRCUIT
|
|
| Temperature Grade |
INDUSTRIAL
|
|
| Terminal Form |
BALL
|
NO LEAD
|
| Terminal Pitch |
1 mm
|
0.5 mm
|
| Terminal Position |
BOTTOM
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
10 mm
|
9 mm
|
| Base Number Matches |
2
|
1
|
| Output Clock Frequency-Max |
|
350 MHz
|
| Package Equivalence Code |
|
LCC64,.35SQ,20
|
| Primary Clock/Crystal Frequency-Nom |
|
750 MHz
|
| Supply Current-Max |
|
260 mA
|
| Supply Voltage-Max |
|
1.89 V
|
| Supply Voltage-Min |
|
1.71 V
|
| Technology |
|
CMOS
|
| uPs/uCs/Peripheral ICs Type |
|
CLOCK GENERATOR, OTHER
|
|
|
|
Compare MAX24310EXG+ with alternatives
Compare SI5345D-D13566-GM with alternatives