MAX31740ATA+
vs
SA56004EDP
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Obsolete
|
Ihs Manufacturer |
ANALOG DEVICES INC
|
NXP SEMICONDUCTORS
|
Part Package Code |
8-LFCSP-2X3X0.75
|
|
Pin Count |
8
|
|
Manufacturer Package Code |
8-LFCSP-2X3X0.75
|
|
Reach Compliance Code |
compliant
|
unknown
|
Date Of Intro |
2013-06-20
|
|
Samacsys Manufacturer |
Analog Devices
|
|
Analog IC - Other Type |
ANALOG CIRCUIT
|
|
JESD-30 Code |
R-PDSO-N8
|
|
JESD-609 Code |
e3
|
|
Length |
3 mm
|
|
Moisture Sensitivity Level |
1
|
|
Number of Channels |
1
|
|
Number of Functions |
1
|
|
Number of Terminals |
8
|
8
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
|
Package Code |
HVSON
|
|
Package Equivalence Code |
SOLCC8,.08,20
|
TSSOP8,.2
|
Package Shape |
RECTANGULAR
|
|
Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
|
Peak Reflow Temperature (Cel) |
260
|
|
Seated Height-Max |
0.8 mm
|
|
Supply Voltage-Max (Vsup) |
5.5 V
|
|
Supply Voltage-Min (Vsup) |
3 V
|
|
Supply Voltage-Nom (Vsup) |
3.3 V
|
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
|
Temperature Grade |
AUTOMOTIVE
|
|
Terminal Finish |
Matte Tin (Sn)
|
|
Terminal Form |
NO LEAD
|
|
Terminal Pitch |
0.5 mm
|
|
Terminal Position |
DUAL
|
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Width |
2 mm
|
|
Base Number Matches |
3
|
1
|
Pbfree Code |
|
No
|
Package Description |
|
TSSOP8,.19
|
Accuracy-Max (Cel) |
|
1 Cel
|
Body Breadth |
|
3 mm
|
Body Height |
|
0.875 mm
|
Body Length or Diameter |
|
3 mm
|
Housing |
|
PLASTIC
|
Mounting Feature |
|
SURFACE MOUNT
|
Number of Bits |
|
11
|
Output Interface Type |
|
2-WIRE INTERFACE
|
Package Shape/Style |
|
SQUARE
|
Sensors/Transducers Type |
|
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL
|
Supply Voltage-Max |
|
5.5 V
|
Supply Voltage-Min |
|
3 V
|
Termination Type |
|
SOLDER
|
|
|
|
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