MAX3225EUP
vs
MAX222MJN
feature comparison
| Pbfree Code |
No
|
No
|
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
ROCHESTER ELECTRONICS LLC
|
ROCHESTER ELECTRONICS LLC
|
| Part Package Code |
TSSOP
|
DIP
|
| Package Description |
TSSOP-20
|
DIP,
|
| Pin Count |
20
|
18
|
| Reach Compliance Code |
unknown
|
unknown
|
| Differential Output |
NO
|
NO
|
| Driver Number of Bits |
2
|
2
|
| Input Characteristics |
SCHMITT TRIGGER
|
SCHMITT TRIGGER
|
| Interface IC Type |
LINE TRANSCEIVER
|
LINE TRANSCEIVER
|
| Interface Standard |
EIA-232; TIA-232; V.24; V.28
|
EIA-232-E; TIA-232-E; V.28; V.24
|
| JESD-30 Code |
R-PDSO-G20
|
R-GDIP-T18
|
| JESD-609 Code |
e0
|
e0
|
| Length |
6.5 mm
|
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Functions |
2
|
2
|
| Number of Terminals |
20
|
18
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-55 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, GLASS-SEALED
|
| Package Code |
TSSOP
|
DIP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
IN-LINE
|
| Peak Reflow Temperature (Cel) |
240
|
240
|
| Receiver Number of Bits |
2
|
2
|
| Seated Height-Max |
1.1 mm
|
5.08 mm
|
| Supply Voltage-Max |
5.5 V
|
5.5 V
|
| Supply Voltage-Min |
3 V
|
4.5 V
|
| Supply Voltage-Nom |
3.3 V
|
5 V
|
| Surface Mount |
YES
|
NO
|
| Technology |
BICMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
MILITARY
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
GULL WING
|
THROUGH-HOLE
|
| Terminal Pitch |
0.65 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
20
|
20
|
| Width |
4.4 mm
|
7.62 mm
|
| Base Number Matches |
2
|
2
|
| Additional Feature |
|
EXTERNAL CHARGE PUMP
|
| Receive Delay-Max |
|
1000 ns
|
| Transmit Delay-Max |
|
3500 ns
|
|
|
|
Compare MAX3225EUP with alternatives
Compare MAX222MJN with alternatives