MAX3387EEUG
vs
ADM3312EACPZ-REEL7
feature comparison
| Pbfree Code |
No
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
ROCHESTER ELECTRONICS LLC
|
ROCHESTER ELECTRONICS LLC
|
| Part Package Code |
TSSOP
|
QFN
|
| Package Description |
4.40 MM, 0.65 MM PITCH, TSSOP-24
|
HVQCCN,
|
| Pin Count |
24
|
32
|
| Reach Compliance Code |
unknown
|
unknown
|
| Differential Output |
NO
|
NO
|
| Driver Number of Bits |
3
|
3
|
| Input Characteristics |
SCHMITT TRIGGER
|
SCHMITT TRIGGER
|
| Interface IC Type |
LINE TRANSCEIVER
|
LINE TRANSCEIVER
|
| Interface Standard |
EIA-232; TIA-232; V.24; V.28
|
EIA-232
|
| JESD-30 Code |
R-PDSO-G24
|
S-XQCC-N32
|
| JESD-609 Code |
e0
|
e3
|
| Length |
7.8 mm
|
5 mm
|
| Moisture Sensitivity Level |
1
|
3
|
| Number of Functions |
1
|
3
|
| Number of Terminals |
24
|
32
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
| Package Code |
TSSOP
|
HVQCCN
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
240
|
260
|
| Qualification Status |
COMMERCIAL
|
|
| Receiver Number of Bits |
3
|
3
|
| Seated Height-Max |
1.1 mm
|
1 mm
|
| Supply Voltage-Max |
5.5 V
|
3.6 V
|
| Supply Voltage-Min |
3 V
|
2.7 V
|
| Supply Voltage-Nom |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
MATTE TIN
|
| Terminal Form |
GULL WING
|
NO LEAD
|
| Terminal Pitch |
0.65 mm
|
0.5 mm
|
| Terminal Position |
DUAL
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
20
|
40
|
| Width |
4.4 mm
|
5 mm
|
| Base Number Matches |
2
|
2
|
| Rohs Code |
|
Yes
|
| Receive Delay-Max |
|
1000 ns
|
| Technology |
|
CMOS
|
|
|
|
Compare MAX3387EEUG with alternatives
Compare ADM3312EACPZ-REEL7 with alternatives