MAX3876EHJ
vs
MAX3840ETJ+T
feature comparison
| Pbfree Code |
No
|
Yes
|
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
MAXIM INTEGRATED PRODUCTS INC
|
| Part Package Code |
QFP
|
QFN
|
| Package Description |
5 X 5 MM, 1 MM HEIGHT, TQFP-32
|
VQCCN,
|
| Pin Count |
32
|
32
|
| Reach Compliance Code |
not_compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
4 Weeks
|
|
| Applications |
ATM; SDH; SONET
|
ATM; SDH; SONET
|
| JESD-30 Code |
S-PQFP-G32
|
S-XQCC-N32
|
| JESD-609 Code |
e0
|
e3
|
| Length |
5 mm
|
5 mm
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
32
|
32
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
| Package Code |
TFQFP
|
VQCCN
|
| Package Equivalence Code |
TQFP32,.28SQ
|
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK, THIN PROFILE, FINE PITCH
|
CHIP CARRIER, VERY THIN PROFILE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.2 mm
|
0.8 mm
|
| Supply Current-Max |
0.167 mA
|
|
| Supply Voltage-Nom |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
BIPOLAR
|
BIPOLAR
|
| Telecom IC Type |
ATM/SONET/SDH CLOCK RECOVERY CIRCUIT
|
ATM/SONET/SDH SWITCHING CIRCUIT
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
MATTE TIN
|
| Terminal Form |
GULL WING
|
NO LEAD
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
5 mm
|
5 mm
|
| Base Number Matches |
2
|
2
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare MAX3876EHJ with alternatives
Compare MAX3840ETJ+T with alternatives