MAX405EPA
vs
CLC111MDC
feature comparison
Rohs Code |
No
|
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
NATIONAL SEMICONDUCTOR CORP
|
Part Package Code |
DIP
|
|
Package Description |
DIP, DIP8,.3
|
DIE,
|
Pin Count |
8
|
|
Reach Compliance Code |
not_compliant
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.33.00.01
|
8542.33.00.01
|
Amplifier Type |
BUFFER
|
BUFFER
|
Average Bias Current-Max (IIB) |
4 µA
|
15 µA
|
Bandwidth (3dB)-Nom |
180 MHz
|
800 MHz
|
Bias Current-Max (IIB) @25C |
0.002 µA
|
|
Input Offset Voltage-Max |
8000 µV
|
9000 µV
|
JESD-30 Code |
R-PDIP-T8
|
R-XUUC-N4
|
JESD-609 Code |
e0
|
|
Length |
9.375 mm
|
|
Moisture Sensitivity Level |
1
|
|
Neg Supply Voltage Limit-Max |
-6 V
|
-7 V
|
Neg Supply Voltage-Nom (Vsup) |
-5 V
|
-5 V
|
Number of Functions |
1
|
1
|
Number of Terminals |
8
|
4
|
Operating Temperature-Max |
85 °C
|
|
Operating Temperature-Min |
-40 °C
|
|
Output Current-Min |
0.06 A
|
0.05 A
|
Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
Package Code |
DIP
|
DIE
|
Package Equivalence Code |
DIP8,.3
|
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
IN-LINE
|
UNCASED CHIP
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
4.572 mm
|
|
Slew Rate-Min |
350 V/us
|
|
Slew Rate-Nom |
650 V/us
|
3500 V/us
|
Supply Current-Max |
43 mA
|
|
Supply Voltage Limit-Max |
6 V
|
7 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
NO
|
YES
|
Technology |
BIPOLAR
|
|
Temperature Grade |
INDUSTRIAL
|
|
Terminal Finish |
TIN LEAD
|
|
Terminal Form |
THROUGH-HOLE
|
NO LEAD
|
Terminal Pitch |
2.54 mm
|
|
Terminal Position |
DUAL
|
UPPER
|
Width |
7.62 mm
|
|
Base Number Matches |
1
|
2
|
|
|
|
Compare MAX405EPA with alternatives
Compare CLC111MDC with alternatives