MAX418MJD
vs
OP295GBC
feature comparison
|
MAX418MJD
Rochester Electronics LLC
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Datasheet
|
OP295GBC
Analog Devices Inc
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Datasheet
|
| Pbfree Code |
No
|
No
|
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
ROCHESTER ELECTRONICS LLC
|
ANALOG DEVICES INC
|
| Part Package Code |
DIP
|
DIE
|
| Package Description |
DIP,
|
DIE
|
| Pin Count |
14
|
8
|
| Reach Compliance Code |
unknown
|
compliant
|
| Amplifier Type |
OPERATIONAL AMPLIFIER
|
OPERATIONAL AMPLIFIER
|
| Average Bias Current-Max (IIB) |
0.001 µA
|
0.02 µA
|
| Common-mode Reject Ratio-Nom |
60 dB
|
110 dB
|
| Input Offset Voltage-Max |
6000 µV
|
300 µV
|
| JESD-30 Code |
R-CDIP-T14
|
R-XUUC-N8
|
| JESD-609 Code |
e0
|
e0
|
| Moisture Sensitivity Level |
1
|
|
| Neg Supply Voltage Limit-Max |
-6 V
|
-18 V
|
| Neg Supply Voltage-Nom (Vsup) |
-2.5 V
|
|
| Number of Functions |
4
|
2
|
| Number of Terminals |
14
|
8
|
| Operating Temperature-Max |
125 °C
|
25 °C
|
| Operating Temperature-Min |
-55 °C
|
25 °C
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
UNSPECIFIED
|
| Package Code |
DIP
|
DIE
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
UNCASED CHIP
|
| Peak Reflow Temperature (Cel) |
240
|
|
| Seated Height-Max |
5.08 mm
|
|
| Slew Rate-Nom |
5000 V/us
|
|
| Supply Voltage Limit-Max |
6 V
|
18 V
|
| Supply Voltage-Nom (Vsup) |
2.5 V
|
5 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
CMOS
|
BICMOS
|
| Temperature Grade |
MILITARY
|
OTHER
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
THROUGH-HOLE
|
NO LEAD
|
| Terminal Pitch |
2.54 mm
|
|
| Terminal Position |
DUAL
|
UPPER
|
| Time@Peak Reflow Temperature-Max (s) |
20
|
|
| Unity Gain BW-Nom |
8
|
75
|
| Width |
7.62 mm
|
|
| Base Number Matches |
2
|
1
|
| Source Content uid |
|
OP295GBC
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8542.31.00.01
|
| Architecture |
|
VOLTAGE-FEEDBACK
|
| Bias Current-Max (IIB) @25C |
|
0.02 µA
|
| Common-mode Reject Ratio-Min |
|
86 dB
|
| Frequency Compensation |
|
YES
|
| Low-Offset |
|
YES
|
| Micropower |
|
YES
|
| Package Equivalence Code |
|
DIE OR CHIP
|
| Power Supplies |
|
3/30/+-3/+-15 V
|
| Qualification Status |
|
Not Qualified
|
| Screening Level |
|
MIL-STD-883 Class B (Modified)
|
| Supply Current-Max |
|
0.3 mA
|
| Voltage Gain-Min |
|
500000
|
|
|
|
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