MAX4219ESD+
vs
MAX469C/D
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
MAXIM INTEGRATED PRODUCTS INC
|
| Part Package Code |
SOIC
|
DIE
|
| Package Description |
SO-14
|
DIE,
|
| Pin Count |
14
|
|
| Reach Compliance Code |
compliant
|
not_compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.33.00.01
|
| Amplifier Type |
BUFFER
|
BUFFER
|
| Average Bias Current-Max (IIB) |
12 µA
|
5 µA
|
| Bandwidth (3dB)-Nom |
200 MHz
|
90 MHz
|
| Input Offset Voltage-Max |
10000 µV
|
15000 µV
|
| JESD-30 Code |
R-PDSO-G14
|
X-XUUC-N
|
| JESD-609 Code |
e3
|
|
| Length |
8.65 mm
|
|
| Moisture Sensitivity Level |
1
|
1
|
| Neg Supply Voltage Limit-Max |
|
-6 V
|
| Neg Supply Voltage-Nom (Vsup) |
|
-5 V
|
| Number of Functions |
3
|
3
|
| Number of Terminals |
14
|
|
| Operating Temperature-Max |
85 °C
|
70 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Output Current-Min |
0.06 A
|
0.02 A
|
| Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
| Package Code |
SOP
|
DIE
|
| Package Equivalence Code |
SOP14,.25
|
|
| Package Shape |
RECTANGULAR
|
UNSPECIFIED
|
| Package Style |
SMALL OUTLINE
|
UNCASED CHIP
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.75 mm
|
|
| Slew Rate-Nom |
600 V/us
|
300 V/us
|
| Supply Current-Max |
21 mA
|
100 mA
|
| Supply Voltage Limit-Max |
12 V
|
6 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
BIPOLAR
|
BIPOLAR
|
| Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
| Terminal Finish |
MATTE TIN
|
|
| Terminal Form |
GULL WING
|
NO LEAD
|
| Terminal Pitch |
1.27 mm
|
|
| Terminal Position |
DUAL
|
UPPER
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
3.9 mm
|
|
| Base Number Matches |
2
|
1
|
|
|
|
Compare MAX4219ESD+ with alternatives
Compare MAX469C/D with alternatives