MAX44269EWL+
vs
MCP6567-E/MSVAO
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
Active
|
| Part Package Code |
9-WLCSP-N/A
|
|
| Pin Count |
9
|
|
| Manufacturer Package Code |
9-WLCSP-N/A
|
|
| Date Of Intro |
2011-10-25
|
|
| Amplifier Type |
COMPARATOR
|
COMPARATOR
|
| Average Bias Current-Max (IIB) |
0.0002 µA
|
0.005 µA
|
| Input Offset Voltage-Max |
10000 µV
|
10000 µV
|
| JESD-30 Code |
S-PBGA-B9
|
R-PDSO-G8
|
| Length |
1.26 mm
|
3 mm
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Functions |
2
|
2
|
| Number of Terminals |
9
|
8
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Type |
OPEN-DRAIN
|
OPEN-DRAIN
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
VFBGA
|
TSSOP
|
| Package Equivalence Code |
BGA9,3X3,16
|
TSSOP8,.19
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Response Time-Nom |
35000 ns
|
80 ns
|
| Seated Height-Max |
0.69 mm
|
1.1 mm
|
| Supply Voltage Limit-Max |
6 V
|
6.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
1.8 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
BICMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
AUTOMOTIVE
|
| Terminal Finish |
Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni)
|
MATTE TIN
|
| Terminal Form |
BALL
|
GULL WING
|
| Terminal Pitch |
0.4 mm
|
0.65 mm
|
| Terminal Position |
BOTTOM
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
40
|
| Width |
1.26 mm
|
3 mm
|
| Base Number Matches |
2
|
1
|
| Ihs Manufacturer |
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
|
TSSOP,
|
| Reach Compliance Code |
|
compliant
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8542.33.00.01
|
| JESD-609 Code |
|
e3
|
| Packing Method |
|
TUBE
|
| Screening Level |
|
TS 16949
|
| Supply Current-Max |
|
0.26 mA
|
|
|
|
Compare MAX44269EWL+ with alternatives
Compare MCP6567-E/MSVAO with alternatives