MAX66242E/W+
vs
MAX66240/W+
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Part Package Code |
NA-BUMPED_CHIP-N/A
|
|
| Pin Count |
0
|
|
| Manufacturer Package Code |
NA-BUMPED_CHIP-N/A
|
|
| Date Of Intro |
2014-09-28
|
|
| Samacsys Manufacturer |
Analog Devices
|
|
| JESD-30 Code |
X-XUUC-N
|
X-XUUC-N
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-20 °C
|
| Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
| Package Code |
DIE
|
DIE
|
| Package Shape |
UNSPECIFIED
|
UNSPECIFIED
|
| Package Style |
UNCASED CHIP
|
UNCASED CHIP
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
NOT SPECIFIED
|
| Supply Voltage-Max |
3.63 V
|
|
| Supply Voltage-Min |
2.97 V
|
|
| Supply Voltage-Nom |
3.3 V
|
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Position |
UPPER
|
UPPER
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
NOT SPECIFIED
|
| uPs/uCs/Peripheral ICs Type |
CRYPTOGRAPHIC AUTHENTICATOR
|
|
| Base Number Matches |
1
|
1
|
| Ihs Manufacturer |
|
MAXIM INTEGRATED PRODUCTS INC
|
| Package Description |
|
WAFER
|
| Reach Compliance Code |
|
compliant
|
| HTS Code |
|
8542.31.00.01
|
| Number of Functions |
|
1
|
| Telecom IC Type |
|
TELECOM CIRCUIT
|
| Temperature Grade |
|
OTHER
|
|
|
|
Compare MAX66242E/W+ with alternatives
Compare MAX66240/W+ with alternatives