MAX6818EAP
vs
MAX6818EAP+
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
ANALOG DEVICES INC
|
| Part Package Code |
SSOP
|
20-SSOP-5.3_MM
|
| Package Description |
SSOP-20
|
5.30 X 6.50 MM, SSOP-20
|
| Pin Count |
20
|
20
|
| Reach Compliance Code |
not_compliant
|
compliant
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.39.00.01
|
|
| Family |
6818
|
|
| JESD-30 Code |
R-PDSO-G20
|
R-PDSO-G20
|
| JESD-609 Code |
e0
|
e3
|
| Length |
7.2 mm
|
7.2 mm
|
| Logic IC Type |
LOGIC CIRCUIT
|
LOGIC CIRCUIT
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Functions |
8
|
1
|
| Number of Terminals |
20
|
20
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Output Polarity |
TRUE
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SSOP
|
SSOP
|
| Package Equivalence Code |
SSOP20,.3
|
SSOP20,.3
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, SHRINK PITCH
|
SMALL OUTLINE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
240
|
260
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.99 mm
|
1.99 mm
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
2.7 V
|
2.7 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
|
| Surface Mount |
YES
|
YES
|
| Technology |
BICMOS
|
CMOS
|
| Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
| Terminal Finish |
TIN LEAD
|
Matte Tin (Sn)
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.65 mm
|
0.65 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
20
|
30
|
| Width |
5.29 mm
|
5.29 mm
|
| Base Number Matches |
5
|
3
|
| Manufacturer Package Code |
|
20-SSOP-5.3_MM
|
| Date Of Intro |
|
1999-01-03
|
| Samacsys Manufacturer |
|
Analog Devices
|
|
|
|
Compare MAX6818EAP with alternatives
Compare MAX6818EAP+ with alternatives