MAX7329AWE+
vs
MCP23S08T-E/MF
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
ANALOG DEVICES INC
|
MICROCHIP TECHNOLOGY INC
|
Part Package Code |
16-SOIC_W-300_MIL
|
QFN
|
Package Description |
0.300 INCH, LEAD FREE, MS013AA, SOIC-16
|
QFN-20
|
Pin Count |
16
|
20
|
Manufacturer Package Code |
16-SOIC_W-300_MIL
|
|
Reach Compliance Code |
compliant
|
compliant
|
Date Of Intro |
2005-11-03
|
|
Samacsys Manufacturer |
Analog Devices
|
|
External Data Bus Width |
|
|
JESD-30 Code |
R-PDSO-G16
|
R-PQCC-N20
|
JESD-609 Code |
e3
|
e3
|
Length |
10.3 mm
|
4 mm
|
Moisture Sensitivity Level |
1
|
1
|
Number of Bits |
8
|
|
Number of I/O Lines |
8
|
8
|
Number of Ports |
1
|
1
|
Number of Terminals |
16
|
20
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
SOP
|
HVQCCN
|
Package Equivalence Code |
SOP16,.4
|
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
2.65 mm
|
1 mm
|
Supply Voltage-Max |
5.5 V
|
5.5 V
|
Supply Voltage-Min |
2.5 V
|
4.5 V
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
BICMOS
|
CMOS
|
Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
Terminal Finish |
Matte Tin (Sn)
|
Matte Tin (Sn)
|
Terminal Form |
GULL WING
|
NO LEAD
|
Terminal Pitch |
1.27 mm
|
0.5 mm
|
Terminal Position |
DUAL
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
30
|
40
|
Width |
7.5 mm
|
4 mm
|
uPs/uCs/Peripheral ICs Type |
PARALLEL IO PORT, GENERAL PURPOSE
|
PARALLEL IO PORT, GENERAL PURPOSE
|
Base Number Matches |
2
|
1
|
Pbfree Code |
|
Yes
|
ECCN Code |
|
EAR99
|
HTS Code |
|
8542.39.00.01
|
Clock Frequency-Max |
|
10 MHz
|
|
|
|
Compare MAX7329AWE+ with alternatives
Compare MCP23S08T-E/MF with alternatives