MAX77812AEWB+T
vs
MAX77812EWB+
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
ANALOG DEVICES INC
|
|
| Part Package Code |
64-WLCSP-N/A
|
64-WLCSP-N/A
|
| Pin Count |
64
|
64
|
| Manufacturer Package Code |
64-WLCSP-N/A
|
64-WLCSP-N/A
|
| Reach Compliance Code |
compliant
|
|
| Date Of Intro |
2018-02-15
|
2018-02-15
|
| Samacsys Manufacturer |
Analog Devices
|
Analog Devices
|
| Additional Feature |
ALSO HAS OUTPUT VOLTAGES 0.8V, 1.1V
|
|
| Analog IC - Other Type |
SWITCHING REGULATOR
|
SWITCHING REGULATOR
|
| Control Technique |
PULSE WIDTH MODULATION
|
|
| Input Voltage-Max |
5.5 V
|
|
| Input Voltage-Min |
2.5 V
|
|
| Input Voltage-Nom |
3.8 V
|
|
| JESD-30 Code |
R-PBGA-B64
|
|
| JESD-609 Code |
e2
|
e2
|
| Length |
3.408 mm
|
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Functions |
1
|
|
| Number of Terminals |
64
|
|
| Operating Temperature-Max |
85 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| Output Current-Max |
5 A
|
|
| Output Voltage-Max |
1.525 V
|
|
| Output Voltage-Min |
0.25 V
|
|
| Output Voltage-Nom |
0.7 V
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
VFBGA
|
|
| Package Equivalence Code |
BGA64,8X8,16
|
|
| Package Shape |
RECTANGULAR
|
|
| Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Seated Height-Max |
0.69 mm
|
|
| Supply Current-Max (Isup) |
0.87 mA
|
|
| Supply Voltage-Nom (Vsup) |
3.8 V
|
|
| Surface Mount |
YES
|
|
| Switcher Configuration |
BUCK
|
|
| Switching Frequency-Max |
2800 kHz
|
|
| Temperature Grade |
INDUSTRIAL
|
|
| Terminal Finish |
Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni)
|
Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni)
|
| Terminal Form |
BALL
|
|
| Terminal Pitch |
0.4 mm
|
|
| Terminal Position |
BOTTOM
|
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
3.368 mm
|
|
| Base Number Matches |
1
|
2
|
|
|
|
Compare MAX77812AEWB+T with alternatives
Compare MAX77812EWB+ with alternatives