MAX860IUA+
vs
ICL7660AIPA
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
HARRIS SEMICONDUCTOR
|
| Part Package Code |
SOIC
|
|
| Package Description |
1.11 MM HEIGHT, LEAD FREE, UMAX-8
|
DIP, DIP8,.3
|
| Pin Count |
8
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Analog IC - Other Type |
SWITCHED CAPACITOR CONVERTER
|
SWITCHED CAPACITOR CONVERTER
|
| Input Voltage-Max |
5.5 V
|
12 V
|
| Input Voltage-Min |
1.5 V
|
1.5 V
|
| Input Voltage-Nom |
5 V
|
5 V
|
| JESD-30 Code |
S-PDSO-G8
|
R-PDIP-T8
|
| JESD-609 Code |
e3
|
e0
|
| Length |
3 mm
|
|
| Moisture Sensitivity Level |
1
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
8
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-25 °C
|
-40 °C
|
| Output Current-Max |
0.06 A
|
0.02 A
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TSSOP
|
DIP
|
| Package Equivalence Code |
TSSOP8,.19
|
DIP8,.3
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
IN-LINE
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.1 mm
|
|
| Surface Mount |
YES
|
NO
|
| Switcher Configuration |
DOUBLER INVERTER
|
DOUBLER INVERTER
|
| Switching Frequency-Max |
130 kHz
|
10 kHz
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
OTHER
|
INDUSTRIAL
|
| Terminal Finish |
MATTE TIN
|
TIN LEAD
|
| Terminal Form |
GULL WING
|
THROUGH-HOLE
|
| Terminal Pitch |
0.65 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
3 mm
|
|
| Base Number Matches |
2
|
3
|
| Supply Current-Max (Isup) |
|
0.165 mA
|
|
|
|
Compare MAX860IUA+ with alternatives
Compare ICL7660AIPA with alternatives