MAX900BMJP
vs
MAX9012ESA
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
MAXIM INTEGRATED PRODUCTS INC
|
| Part Package Code |
DIP
|
SOIC
|
| Package Description |
CERDIP-20
|
SOP, SOP8,.25
|
| Pin Count |
20
|
8
|
| Reach Compliance Code |
compliant
|
not_compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
4 Weeks
|
|
| Amplifier Type |
COMPARATOR
|
COMPARATOR
|
| Average Bias Current-Max (IIB) |
15 µA
|
2 µA
|
| Bias Current-Max (IIB) @25C |
10 µA
|
2 µA
|
| Input Offset Voltage-Max |
6000 µV
|
5500 µV
|
| JESD-30 Code |
R-GDIP-T20
|
R-PDSO-G8
|
| JESD-609 Code |
e0
|
e0
|
| Moisture Sensitivity Level |
1
|
1
|
| Neg Supply Voltage Limit-Max |
-6 V
|
|
| Neg Supply Voltage-Nom (Vsup) |
-5 V
|
|
| Number of Functions |
4
|
2
|
| Number of Terminals |
20
|
8
|
| Operating Temperature-Max |
125 °C
|
85 °C
|
| Operating Temperature-Min |
-55 °C
|
-40 °C
|
| Package Body Material |
CERAMIC, GLASS-SEALED
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
SOP
|
| Package Equivalence Code |
DIP20,.3
|
SOP8,.25
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
SMALL OUTLINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Response Time-Nom |
10 ns
|
5.5 ns
|
| Supply Current-Max |
25 mA
|
4.2 mA
|
| Supply Voltage Limit-Max |
6 V
|
6 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
CMOS
|
BIPOLAR
|
| Temperature Grade |
MILITARY
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
THROUGH-HOLE
|
GULL WING
|
| Terminal Pitch |
2.54 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
No
|
| Length |
|
4.9 mm
|
| Seated Height-Max |
|
1.75 mm
|
| Width |
|
3.9 mm
|
|
|
|
Compare MAX900BMJP with alternatives
Compare MAX9012ESA with alternatives