MAX9259GCB/V+T
vs
MAX9259GCB/V+
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Transferred
|
Active
|
Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
ANALOG DEVICES INC
|
Part Package Code |
QFP
|
64-TQFP_EP-10X10X1.0
|
Package Description |
HTFQFP,
|
10 X 10 MM, 1 MM HEIGHT, ROHS COMPLIANT, TQFP-64
|
Pin Count |
64
|
64
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
|
HTS Code |
8542.39.00.01
|
|
Differential Output |
YES
|
|
Input Characteristics |
STANDARD
|
STANDARD
|
Interface IC Type |
LINE RECEIVER
|
LINE RECEIVER
|
Interface Standard |
ISO 10605
|
ISO 10605
|
JESD-30 Code |
S-PQFP-G64
|
S-PQFP-G64
|
JESD-609 Code |
e3
|
e3
|
Length |
10 mm
|
10 mm
|
Moisture Sensitivity Level |
3
|
3
|
Number of Functions |
1
|
1
|
Number of Terminals |
64
|
64
|
Operating Temperature-Max |
105 °C
|
105 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
HTFQFP
|
HTFQFP
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH
|
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Receiver Number of Bits |
1
|
1
|
Seated Height-Max |
1.2 mm
|
1.2 mm
|
Supply Voltage-Max |
1.9 V
|
1.9 V
|
Supply Voltage-Min |
1.7 V
|
1.7 V
|
Supply Voltage-Nom |
1.8 V
|
1.8 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
MATTE TIN
|
Matte Tin (Sn)
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
QUAD
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Width |
10 mm
|
10 mm
|
Base Number Matches |
3
|
2
|
Manufacturer Package Code |
|
64-TQFP_EP-10X10X1.0
|
Date Of Intro |
|
2009-11-04
|
Samacsys Manufacturer |
|
Analog Devices
|
|
|
|
Compare MAX9259GCB/V+T with alternatives
Compare MAX9259GCB/V+ with alternatives