MAX9259GCB/V+T
vs
MAX9259GTN/V+
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
|
| Part Package Code |
QFP
|
56-LFCSP-8X8X0.75
|
| Package Description |
HTFQFP,
|
|
| Pin Count |
64
|
56
|
| Reach Compliance Code |
compliant
|
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.39.00.01
|
|
| Differential Output |
YES
|
|
| Input Characteristics |
STANDARD
|
|
| Interface IC Type |
LINE RECEIVER
|
LINE DRIVER
|
| Interface Standard |
ISO 10605
|
|
| JESD-30 Code |
S-PQFP-G64
|
|
| JESD-609 Code |
e3
|
e3
|
| Length |
10 mm
|
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of Functions |
1
|
|
| Number of Terminals |
64
|
|
| Operating Temperature-Max |
105 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
HTFQFP
|
|
| Package Shape |
SQUARE
|
|
| Package Style |
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH
|
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
Not Qualified
|
|
| Receiver Number of Bits |
1
|
|
| Seated Height-Max |
1.2 mm
|
|
| Supply Voltage-Max |
1.9 V
|
|
| Supply Voltage-Min |
1.7 V
|
|
| Supply Voltage-Nom |
1.8 V
|
|
| Surface Mount |
YES
|
|
| Technology |
CMOS
|
|
| Temperature Grade |
INDUSTRIAL
|
|
| Terminal Finish |
MATTE TIN
|
Matte Tin (Sn) - annealed
|
| Terminal Form |
GULL WING
|
|
| Terminal Pitch |
0.5 mm
|
|
| Terminal Position |
QUAD
|
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
10 mm
|
|
| Base Number Matches |
3
|
2
|
| Manufacturer Package Code |
|
56-LFCSP-8X8X0.75
|
| Date Of Intro |
|
2009-11-04
|
| Samacsys Manufacturer |
|
Analog Devices
|
|
|
|
Compare MAX9259GCB/V+T with alternatives
Compare MAX9259GTN/V+ with alternatives