MAX9324EUP
vs
MAX9324ETP
feature comparison
Pbfree Code |
No
|
No
|
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
MAXIM INTEGRATED PRODUCTS INC
|
Part Package Code |
TSSOP
|
QFN
|
Package Description |
4.40 MM, TSSOP-20
|
VQCCN, LCC20,.16SQ,20
|
Pin Count |
20
|
20
|
Reach Compliance Code |
not_compliant
|
not_compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Input Conditioning |
DIFFERENTIAL
|
DIFFERENTIAL
|
JESD-30 Code |
R-PDSO-G20
|
S-XQCC-N20
|
JESD-609 Code |
e0
|
e0
|
Length |
6.5 mm
|
4 mm
|
Logic IC Type |
LOW SKEW CLOCK DRIVER
|
LOW SKEW CLOCK DRIVER
|
Max I(ol) |
0.004 A
|
0.004 A
|
Moisture Sensitivity Level |
1
|
1
|
Number of Functions |
1
|
1
|
Number of Inverted Outputs |
|
|
Number of Terminals |
20
|
20
|
Number of True Outputs |
4
|
4
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
Package Code |
TSSOP
|
VQCCN
|
Package Equivalence Code |
TSSOP20,.25
|
LCC20,.16SQ,20
|
Package Shape |
RECTANGULAR
|
SQUARE
|
Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
CHIP CARRIER, VERY THIN PROFILE
|
Prop. Delay@Nom-Sup |
0.6 ns
|
0.6 ns
|
Propagation Delay (tpd) |
0.6 ns
|
0.6 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Same Edge Skew-Max (tskwd) |
0.03 ns
|
0.03 ns
|
Seated Height-Max |
1.1 mm
|
0.8 mm
|
Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
Supply Voltage-Min (Vsup) |
3 V
|
3 V
|
Supply Voltage-Nom (Vsup) |
3.3 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
BICMOS
|
BICMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
Tin/Lead (Sn85Pb15)
|
TIN LEAD
|
Terminal Form |
GULL WING
|
NO LEAD
|
Terminal Pitch |
0.65 mm
|
0.5 mm
|
Terminal Position |
DUAL
|
QUAD
|
Width |
4.4 mm
|
4 mm
|
fmax-Min |
650 MHz
|
650 MHz
|
Base Number Matches |
4
|
3
|
Factory Lead Time |
|
4 Weeks
|
|
|
|
Compare MAX9324EUP with alternatives
Compare MAX9324ETP with alternatives