MAX9644EBS+TG45
vs
MAX9016AEKA+
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Part Package Code |
4-WLCSP-N/A
|
8-SOT_23-N/A
|
| Pin Count |
4
|
8
|
| Manufacturer Package Code |
4-WLCSP-N/A
|
8-SOT_23-N/A
|
| Date Of Intro |
2011-03-30
|
2003-05-26
|
| Samacsys Manufacturer |
Analog Devices
|
Analog Devices
|
| Amplifier Type |
COMPARATOR
|
COMPARATOR
|
| Average Bias Current-Max (IIB) |
0.015 µA
|
0.002 µA
|
| Bias Current-Max (IIB) @25C |
0.015 µA
|
0.001 µA
|
| JESD-30 Code |
S-PBGA-B4
|
R-PDSO-G8
|
| JESD-609 Code |
e2
|
e3
|
| Length |
1 mm
|
2.9 mm
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
4
|
8
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Type |
OPEN-DRAIN
|
OPEN-DRAIN
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
VFBGA
|
TSSOP
|
| Package Equivalence Code |
BGA4,2X2,20
|
TSSOP8,.1
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Packing Method |
TR
|
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Response Time-Nom |
15000 ns
|
31000 ns
|
| Seated Height-Max |
0.59 mm
|
1.45 mm
|
| Supply Current-Max |
0.0011 mA
|
0.002 mA
|
| Supply Voltage Limit-Max |
6 V
|
6 V
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
BICMOS
|
BICMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni)
|
Matte Tin (Sn)
|
| Terminal Form |
BALL
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.65 mm
|
| Terminal Position |
BOTTOM
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
1 mm
|
1.625 mm
|
| Base Number Matches |
1
|
2
|
| Input Offset Voltage-Max |
|
10000 µV
|
| Qualification Status |
|
Not Qualified
|
|
|
|
Compare MAX9644EBS+TG45 with alternatives
Compare MAX9016AEKA+ with alternatives