MAX9644EBS+TG45
vs
MAX9063EBS+TG45
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
MAXIM INTEGRATED PRODUCTS INC
|
Package Description |
VFBGA,
|
UCSP-4
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Amplifier Type |
COMPARATOR
|
COMPARATOR
|
Average Bias Current-Max (IIB) |
0.015 µA
|
0.015 µA
|
Bias Current-Max (IIB) @25C |
0.015 µA
|
|
JESD-30 Code |
S-PBGA-B4
|
S-PBGA-B4
|
JESD-609 Code |
e2
|
e2
|
Length |
1 mm
|
|
Moisture Sensitivity Level |
1
|
1
|
Number of Functions |
1
|
1
|
Number of Terminals |
4
|
4
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output Type |
OPEN-DRAIN
|
OPEN-DRAIN
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
VFBGA
|
BGA
|
Package Equivalence Code |
BGA4,2X2,20
|
BGA4,2X2,20
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
GRID ARRAY
|
Packing Method |
TR
|
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Response Time-Nom |
15000 ns
|
15000 ns
|
Seated Height-Max |
0.59 mm
|
|
Supply Current-Max |
0.0011 mA
|
0.0011 mA
|
Supply Voltage Limit-Max |
6 V
|
6 V
|
Supply Voltage-Nom (Vsup) |
3.3 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
BICMOS
|
BICMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
TIN SILVER COPPER NICKEL
|
TIN SILVER COPPER NICKEL
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Width |
1 mm
|
|
Base Number Matches |
2
|
2
|
Qualification Status |
|
Not Qualified
|
|
|
|
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