MAX9717CEBL+
vs
MAX98309EWL+
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
|
| Part Package Code |
BGA
|
9-WLCSP-N/A
|
| Package Description |
VFBGA,
|
|
| Pin Count |
9
|
9
|
| Reach Compliance Code |
compliant
|
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.33.00.01
|
|
| Factory Lead Time |
4 Weeks
|
|
| Bandwidth-Nom |
22 kHz
|
22 kHz
|
| Consumer IC Type |
AUDIO AMPLIFIER
|
CLASS AB AUDIO AMPLIFIER
|
| Gain |
9 dB
|
|
| JESD-30 Code |
S-PBGA-B9
|
S-PBGA-B9
|
| JESD-609 Code |
e1
|
e2
|
| Length |
1.52 mm
|
0.965 mm
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Channels |
1
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
9
|
9
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Power-Nom |
1.4 W
|
2.7 W
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
VFBGA
|
VFBGA
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
0.67 mm
|
0.69 mm
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
2.7 V
|
2.5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
BICMOS
|
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN SILVER COPPER
|
Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni)
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
0.5 mm
|
0.3 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
1.52 mm
|
0.965 mm
|
| Base Number Matches |
5
|
2
|
| Manufacturer Package Code |
|
9-WLCSP-N/A
|
| Date Of Intro |
|
2011-07-14
|
| Package Equivalence Code |
|
BGA9,3X3,12
|
| Supply Current-Max |
|
1.8 mA
|
|
|
|
Compare MAX9717CEBL+ with alternatives
Compare MAX98309EWL+ with alternatives