MAX97200AEWC+
vs
MAX97200BEWC+
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Active
|
Part Package Code |
12-WLCSP-N/A
|
12-WLCSP-N/A
|
Pin Count |
12
|
12
|
Manufacturer Package Code |
12-WLCSP-N/A
|
12-WLCSP-N/A
|
Date Of Intro |
2010-02-17
|
2010-02-17
|
Samacsys Manufacturer |
Analog Devices
|
Analog Devices
|
Consumer IC Type |
CLASS H AUDIO AMPLIFIER
|
CLASS H AUDIO AMPLIFIER
|
JESD-30 Code |
R-PBGA-B12
|
R-PBGA-B12
|
Length |
1.68 mm
|
1.68 mm
|
Moisture Sensitivity Level |
1
|
1
|
Number of Channels |
2
|
2
|
Number of Functions |
1
|
1
|
Number of Terminals |
12
|
12
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output Power-Nom |
0.045 W
|
0.045 W
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
VFBGA
|
VFBGA
|
Package Equivalence Code |
BGA12,3X4,16
|
BGA12,3X4,16
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
0.69 mm
|
0.69 mm
|
Supply Current-Max |
1.7 mA
|
1.7 mA
|
Supply Voltage-Max (Vsup) |
1.98 V
|
1.98 V
|
Supply Voltage-Min (Vsup) |
1.62 V
|
1.62 V
|
Surface Mount |
YES
|
YES
|
Technology |
BICMOS
|
BICMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni)
|
Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni)
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
0.4 mm
|
0.4 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Width |
1.3 mm
|
1.3 mm
|
Base Number Matches |
2
|
2
|
|
|
|
Compare MAX97200AEWC+ with alternatives
Compare MAX97200BEWC+ with alternatives