MAX97200AEWC+T
vs
MAX97200AEWC+
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
ANALOG DEVICES INC
|
|
| Part Package Code |
12-WLCSP-N/A
|
12-WLCSP-N/A
|
| Package Description |
WLP-12
|
|
| Pin Count |
12
|
12
|
| Manufacturer Package Code |
12-WLCSP-N/A
|
12-WLCSP-N/A
|
| Reach Compliance Code |
compliant
|
|
| Date Of Intro |
2010-02-17
|
2010-02-17
|
| Samacsys Manufacturer |
Analog Devices
|
Analog Devices
|
| Consumer IC Type |
CLASS H AUDIO AMPLIFIER
|
CLASS H AUDIO AMPLIFIER
|
| Gain |
2.92 dB
|
|
| JESD-30 Code |
R-PBGA-B12
|
R-PBGA-B12
|
| Length |
1.68 mm
|
1.68 mm
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Channels |
2
|
2
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
12
|
12
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Power-Nom |
0.045 W
|
0.045 W
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
VFBGA
|
VFBGA
|
| Package Equivalence Code |
BGA12,3X4,16
|
BGA12,3X4,16
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Seated Height-Max |
0.69 mm
|
0.69 mm
|
| Supply Voltage-Max (Vsup) |
1.98 V
|
1.98 V
|
| Supply Voltage-Min (Vsup) |
1.62 V
|
1.62 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
BICMOS
|
BICMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni)
|
Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni)
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
0.4 mm
|
0.4 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
1.3 mm
|
1.3 mm
|
| Base Number Matches |
1
|
2
|
| Qualification Status |
|
Not Qualified
|
| Supply Current-Max |
|
1.7 mA
|
|
|
|
Compare MAX97200AEWC+T with alternatives
Compare MAX97200AEWC+ with alternatives