MAX9725AEBC+T
vs
NE58633BS,157
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
NXP SEMICONDUCTORS
|
Part Package Code |
BGA
|
QFN
|
Package Description |
VFBGA, BGA12,3X4,20
|
HVQCCN, LCC32,.2SQ,20
|
Pin Count |
12
|
32
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.33.00.01
|
8542.33.00.01
|
Factory Lead Time |
4 Weeks
|
|
Bandwidth-Nom |
22 kHz
|
20 kHz
|
Consumer IC Type |
AUDIO AMPLIFIER
|
CLASS D AUDIO AMPLIFIER
|
JESD-30 Code |
R-PBGA-B12
|
S-PQCC-N32
|
JESD-609 Code |
e1
|
e4
|
Length |
2.02 mm
|
5 mm
|
Moisture Sensitivity Level |
1
|
1
|
Number of Channels |
2
|
2
|
Number of Functions |
1
|
1
|
Number of Terminals |
12
|
32
|
Operating Temperature-Max |
85 °C
|
70 °C
|
Operating Temperature-Min |
-40 °C
|
|
Output Power-Nom |
0.025 W
|
0.04 W
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
VFBGA
|
HVQCCN
|
Package Equivalence Code |
BGA12,3X4,20
|
LCC32,.2SQ,20
|
Package Shape |
RECTANGULAR
|
SQUARE
|
Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
Peak Reflow Temperature (Cel) |
260
|
NOT SPECIFIED
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
0.67 mm
|
1 mm
|
Supply Current-Max |
3.3 mA
|
11 mA
|
Supply Voltage-Max (Vsup) |
1.8 V
|
1.7 V
|
Supply Voltage-Min (Vsup) |
0.9 V
|
0.9 V
|
Surface Mount |
YES
|
YES
|
Technology |
BICMOS
|
|
Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
Terminal Finish |
TIN SILVER COPPER
|
Nickel/Palladium/Gold (Ni/Pd/Au)
|
Terminal Form |
BALL
|
NO LEAD
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
BOTTOM
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
30
|
NOT SPECIFIED
|
Width |
1.54 mm
|
5 mm
|
Base Number Matches |
3
|
1
|
Gain |
|
25 dB
|
|
|
|
Compare MAX9725AEBC+T with alternatives
Compare NE58633BS,157 with alternatives