MAX9789AETJ+
vs
LM4882MM/NOPB
feature comparison
Pbfree Code |
Yes
|
Yes
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
NATIONAL SEMICONDUCTOR CORP
|
Part Package Code |
QFN
|
MSOP
|
Package Description |
5 X 5 MM, 0.80 MM HEIGHT, ROHS COMPLIANT, MO-220WHHD-2,TQFN-32
|
TSSOP, TSSOP8,.19
|
Pin Count |
32
|
8
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.33.00.01
|
8542.33.00.01
|
Factory Lead Time |
4 Weeks
|
|
Bandwidth-Nom |
20 kHz
|
20 kHz
|
Consumer IC Type |
CLASS AB AUDIO AMPLIFIER
|
AUDIO AMPLIFIER
|
Gain |
21.6 dB
|
|
JESD-30 Code |
S-XQCC-N32
|
S-PDSO-G8
|
Length |
5 mm
|
3 mm
|
Moisture Sensitivity Level |
1
|
1
|
Number of Channels |
2
|
1
|
Number of Functions |
1
|
1
|
Number of Terminals |
32
|
8
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output Power-Nom |
2 W
|
0.48 W
|
Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
Package Code |
HVQCCN
|
TSSOP
|
Package Equivalence Code |
LCC32,.2SQ,20
|
TSSOP8,.19
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
0.8 mm
|
1.09 mm
|
Supply Current-Max |
40 mA
|
4 mA
|
Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
4.5 V
|
2.4 V
|
Surface Mount |
YES
|
YES
|
Technology |
BICMOS
|
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
NICKEL GOLD PALLADIUM
|
Matte Tin (Sn)
|
Terminal Form |
NO LEAD
|
GULL WING
|
Terminal Pitch |
0.5 mm
|
0.65 mm
|
Terminal Position |
QUAD
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
30
|
40
|
Width |
5 mm
|
3 mm
|
Base Number Matches |
2
|
1
|
JESD-609 Code |
|
e3
|
|
|
|
Compare MAX9789AETJ+ with alternatives
Compare LM4882MM/NOPB with alternatives