MAX98091ETM+T
vs
NAU8810YG
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
SILICON LABORATORIES INC
|
| Package Description |
TQFN-48
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Filter |
YES
|
YES
|
| Input Code |
TWOS COMPLEMENT
|
TWOS COMPLEMENT
|
| Input Type |
SINGLE-ENDED/DIFF
|
SINGLE-ENDED/DIFF
|
| JESD-30 Code |
S-XQCC-N48
|
S-XQCC-N20
|
| JESD-609 Code |
e3
|
|
| Length |
6 mm
|
4 mm
|
| Moisture Sensitivity Level |
1
|
|
| Number of Channels |
6
|
2
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
48
|
20
|
| Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output |
VOLTAGE
|
VOLTAGE
|
| Output Code |
TWOS COMPLEMENT
|
TWOS COMPLEMENT
|
| Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
| Package Code |
HVQCCN
|
HVQCCN
|
| Package Equivalence Code |
LCC48,.24SQ,16
|
LCC20,.16SQ,20
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Seated Height-Max |
0.8 mm
|
0.8 mm
|
| Supply Current-Max |
2 mA
|
|
| Supply Voltage-Nom |
1.2 V
|
1.8 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
|
| Telecom IC Type |
PCM CODEC
|
PROGRAMMABLE CODEC
|
| Terminal Finish |
MATTE TIN
|
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
0.4 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
6 mm
|
4 mm
|
| Base Number Matches |
2
|
1
|
| Companding Law |
|
A/MU-LAW
|
| Linear Coding |
|
24-BIT
|
| Screening Level |
|
TS 16949
|
|
|
|
Compare MAX98091ETM+T with alternatives
Compare NAU8810YG with alternatives