MAX98307ETE+
vs
TPA2029D1YZFT
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Part Package Code |
16-LFCSP-3X3X0.75
|
|
| Pin Count |
16
|
|
| Manufacturer Package Code |
16-LFCSP-3X3X0.75
|
|
| Date Of Intro |
2011-07-14
|
|
| Samacsys Manufacturer |
Analog Devices
|
|
| Bandwidth-Nom |
20 kHz
|
|
| Consumer IC Type |
CLASS DG AUDIO AMPLIFIER
|
CLASS D AUDIO AMPLIFIER
|
| JESD-30 Code |
S-XQCC-N16
|
S-XBGA-B9
|
| JESD-609 Code |
e3
|
e1
|
| Length |
3 mm
|
1.75 mm
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Channels |
1
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
16
|
9
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Power-Nom |
3.3 W
|
3.2 W
|
| Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
| Package Code |
HVQCCN
|
VFBGA
|
| Package Equivalence Code |
LCC16,.12SQ,20
|
BGA9,3X3,20
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
0.8 mm
|
0.625 mm
|
| Supply Current-Max |
2.7 mA
|
5.5 mA
|
| Supply Voltage-Max (Vsup) |
5.25 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
2.6 V
|
2.5 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
Matte Tin (Sn)
|
TIN SILVER COPPER
|
| Terminal Form |
NO LEAD
|
BALL
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
3 mm
|
1.75 mm
|
| Base Number Matches |
4
|
1
|
| Pbfree Code |
|
Yes
|
| Ihs Manufacturer |
|
TEXAS INSTRUMENTS INC
|
| Reach Compliance Code |
|
compliant
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8542.33.00.01
|
| Noise Figure-Nom |
|
95 dB
|
|
|
|
Compare MAX98307ETE+ with alternatives
Compare TPA2029D1YZFT with alternatives