MAX9850ETI+T
vs
MICRF114T-I/OT
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
MICROCHIP TECHNOLOGY INC
|
| Part Package Code |
QFN
|
|
| Package Description |
HVQCCN, LCC28,.2SQ,20
|
LSSOP,
|
| Pin Count |
28
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Consumer IC Type |
CONSUMER CIRCUIT
|
CONSUMER CIRCUIT
|
| JESD-30 Code |
S-XQCC-N28
|
R-PDSO-G6
|
| JESD-609 Code |
e3
|
e4
|
| Length |
5 mm
|
2.9 mm
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
28
|
6
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
| Package Code |
HVQCCN
|
LSSOP
|
| Package Equivalence Code |
LCC28,.2SQ,20
|
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
0.8 mm
|
1.45 mm
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
1.8 V
|
1.8 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
BICMOS
|
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
MATTE TIN
|
NICKEL PALLADIUM GOLD
|
| Terminal Form |
NO LEAD
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.95 mm
|
| Terminal Position |
QUAD
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
40
|
| Width |
5 mm
|
1.55 mm
|
| Base Number Matches |
3
|
1
|
| Factory Lead Time |
|
6 Weeks
|
| Samacsys Manufacturer |
|
Microchip
|
|
|
|
Compare MAX9850ETI+T with alternatives
Compare MICRF114T-I/OT with alternatives