MAX9938TEBS+TG45
vs
MAX9938TEBS+TG45
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
ANALOG DEVICES INC
|
MAXIM INTEGRATED PRODUCTS INC
|
| Part Package Code |
4-WLCSP-N/A
|
|
| Package Description |
ROHS COMPLIANT, UCSP-4
|
ROHS COMPLIANT, UCSP-4
|
| Pin Count |
4
|
|
| Manufacturer Package Code |
4-WLCSP-N/A
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| Date Of Intro |
2008-05-14
|
|
| Samacsys Manufacturer |
Analog Devices
|
|
| Amplifier Type |
OPERATIONAL AMPLIFIER
|
OPERATIONAL AMPLIFIER
|
| Common-mode Reject Ratio-Nom |
130 dB
|
130 dB
|
| Input Offset Voltage-Max |
600 µV
|
600 µV
|
| JESD-30 Code |
S-PBGA-B4
|
S-PBGA-B4
|
| JESD-609 Code |
e2
|
e2
|
| Length |
1 mm
|
1 mm
|
| Moisture Sensitivity Level |
1
|
1
|
| Neg Supply Voltage-Nom (Vsup) |
-3.6 V
|
-3.6 V
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
4
|
4
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
VFBGA
|
VFBGA
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Seated Height-Max |
0.67 mm
|
0.67 mm
|
| Supply Voltage Limit-Max |
30 V
|
30 V
|
| Supply Voltage-Nom (Vsup) |
3.6 V
|
3.6 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
BICMOS
|
BICMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni)
|
TIN SILVER COPPER NICKEL
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
1 mm
|
1 mm
|
| Base Number Matches |
1
|
1
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8542.33.00.01
|
|
|
|
Compare MAX9938TEBS+TG45 with alternatives
Compare MAX9938TEBS+TG45 with alternatives