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MB2245BB,557 vs MB2861BB-T feature comparison

MB2245BB,557 NXP Semiconductors

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MB2861BB-T NXP Semiconductors

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Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Package Description QFP, QFP52,.52SQ
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature WITH DIRECTION CONTROL WITH INDEPENDENT OUTPUT ENABLE FOR EACH DIRECTION
Control Type COMMON CONTROL INDEPENDENT CONTROL
Count Direction BIDIRECTIONAL BIDIRECTIONAL
Family MB MB
JESD-30 Code S-PQFP-G52 S-PQFP-G52
JESD-609 Code e3
Length 10 mm 10 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type BUS TRANSCEIVER BUS TRANSCEIVER
Max I(ol) 0.064 A 0.064 A
Moisture Sensitivity Level 3
Number of Bits 8 10
Number of Functions 2 2
Number of Ports 2 2
Number of Terminals 52 52
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QFP QFP
Package Equivalence Code QFP52,.52SQ QFP52,.52SQ
Package Shape SQUARE SQUARE
Package Style FLATPACK FLATPACK
Peak Reflow Temperature (Cel) 260
Power Supply Current-Max (ICC) 60 mA 72 mA
Prop. Delay@Nom-Sup 5.1 ns 4.6 ns
Propagation Delay (tpd) 5.1 ns 4.6 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.45 mm 2.45 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology BICMOS BICMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Tin (Sn)
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) 30
Width 10 mm 10 mm
Base Number Matches 1 1
Packing Method TR
Logic » Bus Driver/Transceivers
Logic » Bus Driver/Transceivers

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