MB3759Z
vs
HIP6008CB
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Contact Manufacturer
|
Obsolete
|
| Ihs Manufacturer |
FUJITSU LTD
|
INTERSIL CORP
|
| Part Package Code |
DIP
|
SOIC
|
| Package Description |
DIP, DIP16,.3
|
PLASTIC, MS-012AC, SOIC-16
|
| Pin Count |
16
|
16
|
| Reach Compliance Code |
compliant
|
not_compliant
|
| Analog IC - Other Type |
SWITCHING CONTROLLER
|
SWITCHING CONTROLLER
|
| Control Mode |
VOLTAGE-MODE
|
VOLTAGE-MODE
|
| Control Technique |
PULSE WIDTH MODULATION
|
PULSE WIDTH MODULATION
|
| Input Voltage-Max |
32 V
|
13.2 V
|
| Input Voltage-Min |
7 V
|
10.8 V
|
| Input Voltage-Nom |
15 V
|
12 V
|
| JESD-30 Code |
R-GDIP-T16
|
R-PDSO-G16
|
| JESD-609 Code |
e0
|
e0
|
| Length |
19.3 mm
|
9.9 mm
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
16
|
16
|
| Operating Temperature-Max |
85 °C
|
70 °C
|
| Operating Temperature-Min |
-20 °C
|
|
| Output Current-Max |
0.25 A
|
0.35 A
|
| Package Body Material |
CERAMIC, GLASS-SEALED
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
SOP
|
| Package Equivalence Code |
DIP16,.3
|
SOP16,.25
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
SMALL OUTLINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
5.08 mm
|
1.75 mm
|
| Supply Current-Max (Isup) |
12 mA
|
|
| Surface Mount |
NO
|
YES
|
| Switcher Configuration |
PUSH-PULL
|
SINGLE
|
| Switching Frequency-Max |
300 kHz
|
1000 kHz
|
| Technology |
BIPOLAR
|
BIPOLAR
|
| Temperature Grade |
OTHER
|
COMMERCIAL
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
THROUGH-HOLE
|
GULL WING
|
| Terminal Pitch |
2.54 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
7.62 mm
|
3.9 mm
|
| Base Number Matches |
2
|
3
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8542.39.00.01
|
| Factory Lead Time |
|
4 Weeks
|
| Additional Feature |
|
ALSO OPERATES AT 5 V INPUT
|
|
|
|
Compare MB3759Z with alternatives
Compare HIP6008CB with alternatives