MB3821PFV
vs
MB3821PFV
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Contact Manufacturer
|
Transferred
|
| Ihs Manufacturer |
FUJITSU LTD
|
FUJITSU SEMICONDUCTOR AMERICA INC
|
| Part Package Code |
SSOP
|
SSOP
|
| Package Description |
LSSOP, TSSOP24,.3
|
LSSOP,
|
| Pin Count |
24
|
24
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Analog IC - Other Type |
DUAL SWITCHING CONTROLLER
|
DUAL SWITCHING CONTROLLER
|
| Control Mode |
VOLTAGE-MODE
|
|
| Control Technique |
PULSE WIDTH MODULATION
|
PULSE WIDTH MODULATION
|
| Input Voltage-Max |
30 V
|
30 V
|
| Input Voltage-Min |
4.5 V
|
4.5 V
|
| Input Voltage-Nom |
16 V
|
16 V
|
| JESD-30 Code |
R-PDSO-G24
|
R-PDSO-G24
|
| Length |
7.75 mm
|
7.75 mm
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
24
|
24
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-30 °C
|
-30 °C
|
| Output Current-Max |
0.5 A
|
0.5 A
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LSSOP
|
LSSOP
|
| Package Equivalence Code |
TSSOP24,.3
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
|
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.45 mm
|
1.45 mm
|
| Surface Mount |
YES
|
YES
|
| Switcher Configuration |
PUSH-PULL
|
PHASE-SHIFT
|
| Switching Frequency-Max |
500 kHz
|
500 kHz
|
| Temperature Grade |
OTHER
|
OTHER
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.65 mm
|
0.65 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
5.6 mm
|
5.6 mm
|
| Base Number Matches |
3
|
1
|
| Pbfree Code |
|
No
|
|
|
|