MB509P vs MB509P feature comparison

MB509P FUJITSU Semiconductor Limited

Buy Now Datasheet

MB509P FUJITSU Limited

Buy Now Datasheet
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer FUJITSU SEMICONDUCTOR AMERICA INC FUJITSU SEMICONDUCTOR AMERICA INC
Package Description DIP, DIP,
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature STAND-BY MODE STAND-BY MODE
Family ECL ECL
JESD-30 Code R-PDIP-T8 R-PDIP-T8
Length 9.4 mm 9.4 mm
Load Capacitance (CL) 8 pF 8 pF
Number of Data/Clock Inputs 1 1
Number of Functions 1 1
Number of Terminals 8 8
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics EMITTER FOLLOWER EMITTER FOLLOWER
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.36 mm 4.36 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology BIPOLAR BIPOLAR
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm 7.62 mm
fmax-Min 1100 MHz 1100 MHz
Base Number Matches 4 4
Part Package Code DIP
Pin Count 8

Compare MB509P with alternatives

Compare MB509P with alternatives