MC100EL12DG
vs
SY100EL12ZI
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Obsolete
|
Not Recommended
|
| Ihs Manufacturer |
ONSEMI
|
MICROCHIP TECHNOLOGY INC
|
| Part Package Code |
SOIC
|
SOIC
|
| Package Description |
LEAD FREE, SOIC-8
|
SOIC-8
|
| Pin Count |
8
|
8
|
| Manufacturer Package Code |
751-07
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Additional Feature |
NECL MODE: VCC = 0V WITH VEE = -4.2V TO -5.7V
|
|
| Family |
100EL
|
100EL
|
| JESD-30 Code |
R-PDSO-G8
|
R-PDSO-G8
|
| JESD-609 Code |
e3
|
|
| Length |
4.9 mm
|
4.93 mm
|
| Logic IC Type |
OR/NOR GATE
|
OR/NOR GATE
|
| Moisture Sensitivity Level |
1
|
|
| Number of Functions |
1
|
1
|
| Number of Inputs |
2
|
2
|
| Number of Terminals |
8
|
8
|
| Operating Temperature-Max |
85 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
SOP
|
| Package Equivalence Code |
SOP8,.25
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Propagation Delay (tpd) |
0.45 ns
|
0.45 ns
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
1.75 mm
|
1.73 mm
|
| Supply Voltage-Max (Vsup) |
5.7 V
|
-5.5 V
|
| Supply Voltage-Min (Vsup) |
4.2 V
|
-4.2 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
-4.5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
ECL
|
ECL
|
| Temperature Grade |
INDUSTRIAL
|
|
| Terminal Finish |
TIN
|
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
3.9 mm
|
3.94 mm
|
| Base Number Matches |
1
|
2
|
|
|
|
Compare MC100EL12DG with alternatives
Compare SY100EL12ZI with alternatives