MC100EP016FAG
vs
MC10EP016FA
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
ON SEMICONDUCTOR
|
CHERRY SEMICONDUCTOR CORP
|
| Part Package Code |
QFP
|
|
| Package Description |
LQFP, QFP32,.35SQ,32
|
PLASTIC, TQFP-32
|
| Pin Count |
32
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
|
| Additional Feature |
NECL MODE: 0V VCC WITH VEE = -3.0V TO -5.5V
|
|
| Count Direction |
UP
|
|
| Family |
100EP
|
|
| JESD-30 Code |
S-PQFP-G32
|
S-PQFP-G32
|
| Length |
7 mm
|
|
| Logic IC Type |
BINARY COUNTER
|
BINARY COUNTER
|
| Max Frequency@Nom-Sup |
1000000000 Hz
|
|
| Mode of Operation |
SYNCHRONOUS
|
|
| Number of Bits |
8
|
|
| Number of Functions |
1
|
|
| Number of Terminals |
32
|
32
|
| Operating Temperature-Max |
85 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LQFP
|
|
| Package Equivalence Code |
QFP32,.35SQ,32
|
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK, LOW PROFILE
|
FLATPACK
|
| Packing Method |
TRAY
|
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Power Supply Current-Max (ICC) |
200 mA
|
|
| Propagation Delay (tpd) |
0.7 ns
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.6 mm
|
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
|
| Supply Voltage-Min (Vsup) |
3 V
|
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
|
| Surface Mount |
YES
|
YES
|
| Technology |
ECL
|
|
| Temperature Grade |
INDUSTRIAL
|
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.8 mm
|
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
|
| Trigger Type |
POSITIVE EDGE
|
|
| Width |
7 mm
|
|
| Base Number Matches |
1
|
5
|
|
|
|
Compare MC100EP016FAG with alternatives
Compare MC10EP016FA with alternatives