MC100EP29DT
vs
MC10EP51MNR4G
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
ROCHESTER ELECTRONICS LLC
|
ONSEMI
|
| Part Package Code |
TSSOP
|
DFN
|
| Pin Count |
20
|
8
|
| Reach Compliance Code |
unknown
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Logic IC Type |
D FLIP-FLOP
|
D FLIP-FLOP
|
| Base Number Matches |
3
|
1
|
| Rohs Code |
|
Yes
|
| Package Description |
|
DFN-8
|
| Manufacturer Package Code |
|
506AA
|
| Factory Lead Time |
|
4 Weeks
|
| Samacsys Manufacturer |
|
onsemi
|
| Additional Feature |
|
NECL MODE: VCC = 0V WITH VEE = -3V TO -5.5V
|
| Family |
|
10E
|
| JESD-30 Code |
|
S-XDSO-N8
|
| Length |
|
2 mm
|
| Max Frequency@Nom-Sup |
|
3000000000 Hz
|
| Moisture Sensitivity Level |
|
1
|
| Number of Bits |
|
1
|
| Number of Functions |
|
1
|
| Number of Terminals |
|
8
|
| Operating Temperature-Max |
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Output Polarity |
|
COMPLEMENTARY
|
| Package Body Material |
|
UNSPECIFIED
|
| Package Code |
|
HVSON
|
| Package Equivalence Code |
|
SOLCC8,.08,20
|
| Package Shape |
|
SQUARE
|
| Package Style |
|
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Packing Method |
|
TR
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Power Supply Current-Max (ICC) |
|
47 mA
|
| Prop. Delay@Nom-Sup |
|
0.42 ns
|
| Propagation Delay (tpd) |
|
0.37 ns
|
| Qualification Status |
|
Not Qualified
|
| Seated Height-Max |
|
1 mm
|
| Supply Voltage-Max (Vsup) |
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
|
3 V
|
| Supply Voltage-Nom (Vsup) |
|
3.3 V
|
| Surface Mount |
|
YES
|
| Technology |
|
ECL
|
| Temperature Grade |
|
INDUSTRIAL
|
| Terminal Finish |
|
NICKEL GOLD PALLADIUM
|
| Terminal Form |
|
NO LEAD
|
| Terminal Pitch |
|
0.5 mm
|
| Terminal Position |
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
| Trigger Type |
|
POSITIVE EDGE
|
| Width |
|
2 mm
|
|
|
|
Compare MC100EP29DT with alternatives
Compare MC10EP51MNR4G with alternatives