MC100EP29DT
vs
SY10EP31VZI
feature comparison
| Pbfree Code |
Yes
|
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
ROCHESTER ELECTRONICS LLC
|
MICROCHIP TECHNOLOGY INC
|
| Part Package Code |
TSSOP
|
SOIC
|
| Pin Count |
20
|
8
|
| Reach Compliance Code |
unknown
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Logic IC Type |
D FLIP-FLOP
|
D FLIP-FLOP
|
| Base Number Matches |
3
|
2
|
| Package Description |
|
SOIC-8
|
| Additional Feature |
|
NECL MODE: VCC = 0V WITH VEE = -3.3V TO -5V 10%, ALSO OPERATES AT 5V SUPPLY
|
| Family |
|
10E
|
| JESD-30 Code |
|
R-PDSO-G8
|
| JESD-609 Code |
|
e0
|
| Length |
|
4.93 mm
|
| Max Frequency@Nom-Sup |
|
3000000000 Hz
|
| Moisture Sensitivity Level |
|
1
|
| Number of Bits |
|
1
|
| Number of Functions |
|
1
|
| Number of Terminals |
|
8
|
| Operating Temperature-Max |
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Output Polarity |
|
COMPLEMENTARY
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Code |
|
SOP
|
| Package Equivalence Code |
|
SOP8,.25
|
| Package Shape |
|
RECTANGULAR
|
| Package Style |
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
|
240
|
| Power Supply Current-Max (ICC) |
|
47 mA
|
| Propagation Delay (tpd) |
|
0.41 ns
|
| Qualification Status |
|
Not Qualified
|
| Seated Height-Max |
|
1.73 mm
|
| Supply Voltage-Max (Vsup) |
|
3.63 V
|
| Supply Voltage-Min (Vsup) |
|
2.97 V
|
| Supply Voltage-Nom (Vsup) |
|
3.3 V
|
| Surface Mount |
|
YES
|
| Technology |
|
ECL
|
| Temperature Grade |
|
INDUSTRIAL
|
| Terminal Finish |
|
Tin/Lead (Sn85Pb15)
|
| Terminal Form |
|
GULL WING
|
| Terminal Pitch |
|
1.27 mm
|
| Terminal Position |
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
| Trigger Type |
|
POSITIVE EDGE
|
| Width |
|
3.94 mm
|
| fmax-Min |
|
3000 MHz
|
|
|
|
Compare MC100EP29DT with alternatives
Compare SY10EP31VZI with alternatives