MC100EP29DTG
vs
MC10EP29MNG
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
ROCHESTER ELECTRONICS LLC
|
ROCHESTER ELECTRONICS LLC
|
| Part Package Code |
TSSOP
|
QFN
|
| Package Description |
LEAD FREE, TSSOP-20
|
LEAD FREE, QFN-20
|
| Pin Count |
20
|
20
|
| Reach Compliance Code |
unknown
|
unknown
|
| Additional Feature |
NECL MODE: VCC = 0V WITH VEE = -3V TO -5.5V
|
NECL MODE: VCC = 0V WITH VEE = -3V TO -5.5V
|
| Family |
100E
|
10E
|
| JESD-30 Code |
R-PDSO-G20
|
S-XQCC-N20
|
| JESD-609 Code |
e4
|
e3
|
| Length |
6.5 mm
|
4 mm
|
| Logic IC Type |
D FLIP-FLOP
|
D FLIP-FLOP
|
| Moisture Sensitivity Level |
NOT SPECIFIED
|
NOT SPECIFIED
|
| Number of Bits |
1
|
1
|
| Number of Functions |
2
|
2
|
| Number of Terminals |
20
|
20
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Polarity |
COMPLEMENTARY
|
COMPLEMENTARY
|
| Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
| Package Code |
TSSOP
|
HVQCCN
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
260
|
NOT SPECIFIED
|
| Propagation Delay (tpd) |
0.5 ns
|
0.5 ns
|
| Qualification Status |
COMMERCIAL
|
COMMERCIAL
|
| Seated Height-Max |
1.2 mm
|
1 mm
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
3 V
|
3 V
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
ECL
|
ECL
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
MATTE TIN
|
| Terminal Form |
GULL WING
|
NO LEAD
|
| Terminal Pitch |
0.65 mm
|
0.5 mm
|
| Terminal Position |
DUAL
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
NOT SPECIFIED
|
| Trigger Type |
POSITIVE EDGE
|
POSITIVE EDGE
|
| Width |
4.4 mm
|
4 mm
|
| Base Number Matches |
2
|
2
|
|
|
|