MC100ES6221TB
vs
MC100ES6221TBR2
feature comparison
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
MOTOROLA INC
|
FREESCALE SEMICONDUCTOR INC
|
| Part Package Code |
QFP
|
QFP
|
| Package Description |
HLQFP, QFP52,.47SQ
|
EXPOSED PAD, PLASTIC, LQFP-52
|
| Pin Count |
52
|
52
|
| Reach Compliance Code |
unknown
|
not_compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Additional Feature |
ECL MODE: VCC = 0V WITH VEE = -2.5V OR -3.3V SUPPLY
|
ECL MODE: VCC = 0V WITH VEE = -2.5V OR -3.3V SUPPLY
|
| Family |
100E
|
100E
|
| Input Conditioning |
DIFFERENTIAL MUX
|
DIFFERENTIAL MUX
|
| JESD-30 Code |
S-PQFP-G52
|
S-PQFP-G52
|
| Length |
10 mm
|
10 mm
|
| Logic IC Type |
LOW SKEW CLOCK DRIVER
|
LOW SKEW CLOCK DRIVER
|
| Number of Functions |
1
|
1
|
| Number of Inverted Outputs |
|
|
| Number of Terminals |
52
|
52
|
| Number of True Outputs |
20
|
20
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HLQFP
|
HLQFP
|
| Package Equivalence Code |
QFP52,.47SQ
|
QFP52,.47SQ
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK, HEAT SINK/SLUG, LOW PROFILE
|
FLATPACK, HEAT SINK/SLUG, LOW PROFILE
|
| Propagation Delay (tpd) |
0.95 ns
|
0.95 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Same Edge Skew-Max (tskwd) |
0.1 ns
|
0.1 ns
|
| Seated Height-Max |
1.7 mm
|
1.7 mm
|
| Supply Voltage-Max (Vsup) |
2.625 V
|
2.625 V
|
| Supply Voltage-Min (Vsup) |
2.375 V
|
2.375 V
|
| Supply Voltage-Nom (Vsup) |
2.5 V
|
2.5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
ECL
|
ECL
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.65 mm
|
0.65 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
10 mm
|
10 mm
|
| Base Number Matches |
5
|
4
|
| Rohs Code |
|
No
|
| JESD-609 Code |
|
e0
|
| Max I(ol) |
|
0.005 A
|
| Moisture Sensitivity Level |
|
3
|
| Prop. Delay@Nom-Sup |
|
0.95 ns
|
| Terminal Finish |
|
TIN LEAD
|
|
|
|
Compare MC100ES6221TB with alternatives
Compare MC100ES6221TBR2 with alternatives